Analog Devices, Inc.
PACKAGE WITH OVERHANG INDUCTOR

Abstract:

This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.