Analog Devices, Inc.
Compact integrated device packages

Abstract:

Compact integrated device packages are disclosed. The package comprises a package substrate, a first integrated device die, and a second integrated device die. The first die and the second die are mounted and electrically connected to a first segment and a second segment of the package substrate respectively. The substrate comprises a bendable segment disposed between the first and second segment and can bend so as to angle the first die relative to the second die.