Analog Devices, Inc.
Transfer printing method
Last updated:
Abstract:
A transfer printing method provides a first wafer having a receiving surface, and removes a second die from a second wafer using a die moving member. Next, the method positions the second die on the receiving surface of the first wafer. Specifically, to position the second die on the receiving surface, the first wafer has alignment structure for at least in part controlling movement of the die moving member.
Status:
Grant
Type:
Utility
Filling date:
27 Oct 2015
Issue date:
31 Dec 2019