Analog Devices, Inc.
Heat management in a multi-finger FET

Abstract:

The present disclosure addresses thermal issues in a multi gate finger field-effect transistor (FET) by providing a multi-gate finger FET arrangement where the respective distances between the multiple gate fingers are modulated along the device, such that the distances between the gate fingers in or towards the middle of the device are greater than the distances between the gate fingers at the or towards the edge of the device. By providing the greater distances between gate fingers located in or towards the middle of the device then improved thermal management properties are obtained, and the device as a whole is maintained cooler than would otherwise be the case, with associated improvements in device lifetimes.