Wolfspeed, Inc.
Semiconductor Having a Backside Wafer Cavity for Radio Frequency (RF) Passive Device Integration and/or Improved Cooling and Process of Implementing the Same

Abstract:

A semiconductor device configured for a radio frequency (RF) application and further configured for passive device integration and/or improved cooling includes a substrate; an active region portion arranged on the substrate, the active region portion includes at least one radio frequency (RF) transistor amplifier; a cavity arranged within the substrate; and one or more radio frequency (RF) devices arranged in the cavity.