Wolfspeed, Inc.
SEMICONDUCTOR POWER DEVICES HAVING GATE DIELECTRIC LAYERS WITH IMPROVED BREAKDOWN CHARACTERISTICS AND METHODS OF FORMING SUCH DEVICES
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Abstract:
A semiconductor device includes a semiconductor layer structure that includes silicon carbide, a gate dielectric layer on the semiconductor layer structure, and a gate electrode on the gate dielectric layer opposite the semiconductor layer structure. In some embodiments, a periphery of a portion of the gate dielectric layer that underlies the gate electrode is thicker than a central portion of the gate dielectric layer, and a lower surface of the gate electrode has recessed outer edges such as rounded and/or beveled outer edges.
Status:
Application
Type:
Utility
Filling date:
22 Apr 2020
Issue date:
28 Oct 2021