Wolfspeed, Inc.
SEMICONDUCTOR POWER DEVICES HAVING GATE DIELECTRIC LAYERS WITH IMPROVED BREAKDOWN CHARACTERISTICS AND METHODS OF FORMING SUCH DEVICES

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Abstract:

A semiconductor device includes a semiconductor layer structure that includes silicon carbide, a gate dielectric layer on the semiconductor layer structure, and a gate electrode on the gate dielectric layer opposite the semiconductor layer structure. In some embodiments, a periphery of a portion of the gate dielectric layer that underlies the gate electrode is thicker than a central portion of the gate dielectric layer, and a lower surface of the gate electrode has recessed outer edges such as rounded and/or beveled outer edges.

Status:
Application
Type:

Utility

Filling date:

22 Apr 2020

Issue date:

28 Oct 2021