Wolfspeed, Inc.
PACKAGING FOR RF TRANSISTOR AMPLIFIERS

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Abstract:

RF transistor amplifiers an RF transistor amplifier die having a semiconductor layer structure, an interconnect structure having first and second opposing sides, wherein the first side of the interconnect structure is adjacent a surface of the RF transistor amplifier die such that the interconnect structure and the RF transistor amplifier die are in a stacked arrangement, and one or more circuit elements on the first and/or second side of the interconnect structure.

Status:
Application
Type:

Utility

Filling date:

11 Sep 2020

Issue date:

17 Mar 2022