Wolfspeed, Inc.
LIGHT EMITTING DIODES AND METHODS

Abstract:

Light emitting diode (LED) devices, methods and systems are provided. An example apparatus can include an underfill layer separate from a bonding layer. The apparatus can further include a dark encapsulating layer comprising an epoxy-molded compound which is applied using a powder-coating process. A method for providing a powder-coated encapsulation and for producing an LED panel with such an encapsulant is disclosed.