Microchip Technology Incorporated
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTIPLE LEAD FRAMES AND RELATED METHODS

Abstract:

Semiconductor device packages may include a semiconductor die including a first major surface affixed and electrically connected to a first lead frame. A second lead frame may be affixed and electrically connected to a second major surface located on a side of the semiconductor die opposite the first major surface. A molding material may encapsulate the semiconductor die and at least portions of the first lead frame and the second lead frame.