Microchip Technology Incorporated
Method of manufacturing damascene thin-film resistor (TFR) in poly-metal dielectric

Abstract:

A damascene thin-film resistor (TFR), e.g., a damascene thin-film resistor module formed within a poly-metal dielectric (PMD) layer using a single added mask layer, and a method for manufacturing such a device, are disclosed. A method for manufacturing a TFR structure may include forming a pair of spaced-apart TFR heads formed as self-aligned silicide poly (salicide) structures, depositing a dielectric layer over the salicide TFR heads, patterning and etching a trench extending laterally over at least a portion of each salicide TFR head and exposing a surface of each salicide TFR heads is exposed, and depositing a TFR material into the trench and onto the exposed TFR head surfaces, to thereby form a TFR layer that bridges the pair of spaced-apart TFR heads.