Microchip Technology Incorporated
TECHNIQUES FOR MAKING INTEGRATED INDUCTORS AND RELATED SEMICONDUCTOR DEVICES, ELECTRONIC SYSTEMS, AND METHODS

Abstract:

In some embodiments, integrated inductors may be built using processes for forming interconnects of semiconductor devices without requiring additional process steps. Integrated inductor coils may be formed by, for example, shunting an overlying electrically conductive material, such as, for example, bond pad metals (e.g., aluminum and alloys thereof), to an underlying electrically conductive material, such as, for example, an uppermost layer of wiring formed using Damascene processes (e.g., utilizing copper and alloys thereof), without vias to interconnect the two materials. In some embodiments, integrated inductors formed utilizing such processes may have a symmetric spiral design.