Skyworks Solutions, Inc.
METHOD OF MAKING A PACKAGED ACOUSTIC WAVE DEVICES WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE

Abstract:

Aspects of this disclosure relate to a method of manufacturing a packaged acoustic wave component with two acoustic wave devices interconnected by a thermally conductive frame. The method includes providing a first acoustic wave device having a multi-layer piezoelectric substrate structure with a first piezoelectric layer disposed over a first support layer and an interdigital transducer electrode. The method further includes stacking the first acoustic wave device relative to a second acoustic wave device such that a thermally conductive frame extends between the first acoustic wave device and the second acoustic wave device. The thermally conductive frame provides a thermal path for heat dissipation from the first acoustic wave device to the second acoustic wave device.