Skyworks Solutions, Inc.
Capacitor metal guard ring for moisture ingression prevention

Last updated:

Abstract:

A semiconductor die includes at least one electronic component. an at least partially moisture permeable material disposed on or about the at least one electronic component, at least one opening defining at least one path for moisture to migrate from an environment external to the die into the at least partially moisture permeable material, and a moisture impermeable shield disposed between the at least one electronic component and the at least one opening.

Status:
Grant
Type:

Utility

Filling date:

19 Dec 2018

Issue date:

9 Feb 2021