Skyworks Solutions, Inc.
METHOD OF MAKING A MOISTURE BARRIER FOR METAL INSULATOR METAL CAPACITORS IN INTEGRATED CIRCUITS

Abstract:

A semiconductor die includes a substrate layer, one or more metal layers disposed over the substrate layer, and one or more polyimide layers disposed over the substrate. Each polyimide layer can have a trench that separates a first portion of the polyimide layer that is adjacent a metal layer from a second portion of the polyimide layer. The trench(es) can be formed by etching the polyimide layer(s). A topcoat insulation layer can be disposed over the polyimide layers, a portion of the topcoat insulation layer disposed over the trench(es) define a moat. The topcoat insulation layer is impervious to moisture and the moat inhibits moisture from traveling along the one or more polymer interlevel dielectric layers from the second portion to the first portion.