Skyworks Solutions, Inc.
METHODS AND APPARATUSES FOR REMOVAL OF WIRES FROM PACKAGING SUBSTRATES

Abstract:

Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include receiving by an automated wire cutting apparatus a packaging substrate including a die mounted thereon and a defective wire coupled thereto, positioning one or both of a wire cutting instrument of the automated wire cutting apparatus and the packaging substrate relative to the other based on predetermined instructions, and detaching the defective wire from the packaging substrate using the wire cutting instrument.