Textron Inc.
METHODS FOR FORMING BONDED STRUCTURES

Abstract:

A method is provided in one example embodiment and may include assembling a first component and a second component together using, at least in part, a first adhesive film on the first component and a second adhesive film on the second component, wherein the first component and the second component are fully cured and the first adhesive film and the second adhesive film are at least partially uncured; and curing the first adhesive film and the second adhesive film to form a bonded structure.