Xilinx, Inc.
Package integration for laterally mounted IC dies with dissimilar solder interconnects

Abstract:

A chip package assembly and method of fabricating the same are described herein. The chip package assembly generally includes at least one integrated circuit (IC) die that has had the original solder interconnects at least partially replaced to enhance the reliability of a redistribution layer disposed between the IC die and the substrate. In the resulting chip package assembly, at least one IC die includes first and second pillars extending from exposed contact pads through a first mold compound. The second pillars are fabricated from a material that has a composition different than that of the first pillars. A redistribution layer is formed on the first and second pillars. The solder interconnects mechanically couple the redistribution layer to landing pads of a substrate. The solder interconnects also electrically couple circuitry of the substrate to the circuitry of the IC die through the redistribution layer and first and second pillars.