Xilinx, Inc.
Circuit for and method of transmitting a signal in an integrated circuit device

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Abstract:

A circuit for transmitting signals in an integrated circuit device is described. The circuit comprises a first die; a second die stacked on the first die; and a buffer transmitting data between the first die and the second die; wherein a first inverter of the buffer is on the first die, and a second inverter of the buffer is on the second die. A method of transmitting signals in an integrated circuit device is also described.

Status:
Grant
Type:

Utility

Filling date:

10 May 2019

Issue date:

13 Oct 2020