Xilinx, Inc.
Systems and methods for on-die heat generation and temperature sensing

Last updated:

Abstract:

A thermal management system includes an integrated circuit (IC). The IC includes a plurality of digitally addressable sectors. Each sector includes an on-die sensing element. The on-die sensing element includes an on-die temperature sensor configured to measure a sector temperature and provide an analog signal associated with the sector temperature; and an on-die digitizer configured to generate a digital sensed temperature signal based on the analog signal. The IC further includes a first output configured to output a plurality of digital sensed temperature signals from the plurality of sectors.

Status:
Grant
Type:

Utility

Filling date:

1 May 2018

Issue date:

14 Apr 2020