Xilinx, Inc.
Systems and methods for on-die heat generation and temperature sensing
Last updated:
Abstract:
A thermal management system includes an integrated circuit (IC). The IC includes a plurality of digitally addressable sectors. Each sector includes an on-die sensing element. The on-die sensing element includes an on-die temperature sensor configured to measure a sector temperature and provide an analog signal associated with the sector temperature; and an on-die digitizer configured to generate a digital sensed temperature signal based on the analog signal. The IC further includes a first output configured to output a plurality of digital sensed temperature signals from the plurality of sectors.
Status:
Grant
Type:
Utility
Filling date:
1 May 2018
Issue date:
14 Apr 2020