Xilinx, Inc.
Isolation enhancement with on-die slot-line on power/ground grid structure
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Abstract:
Examples herein describe techniques for isolating portions of an IC that include sensitive components (e.g., inductors or capacitors) from return current in a grounding plane. An output current generated by a transmitter or driver in an IC can generate a magnetic field which induces return current in the grounding plane. If the return current is proximate the sensitive components, the return current can inject noise which can negatively impact other components in the IC. To isolate the sensitive components from the return current, embodiments herein include forming slots through the grounding structure which includes the grounding plane on one or more sides of the sensitive components.
Status:
Grant
Type:
Utility
Filling date:
19 Jan 2018
Issue date:
11 Feb 2020