Xilinx, Inc.
Integrated circuit package testing system

Abstract:

An integrated chip package assembly test system and method for testing a chip package assembly are described herein. In one example, an integrated circuit chip package test system includes a socket and a workpress. The socket is configured to receive a chip package assembly for testing in the test system. The workpress includes a plurality of pusher pins. The plurality of pusher pins have tips extending from a bottom surface of the workpress. Each of the plurality of pusher pins is configured to apply an independent and discrete force to the chip package assembly disposed in the socket.