Xilinx, Inc.
Die-to-die communications scheme

Abstract:

Examples described herein provide a communication scheme between integrated circuit (IC) dies. In an example, an IC package includes a first IC die and a second IC die. The first IC die includes an encoder/decoder configured to implement encoded communications. The second IC die includes a transceiver configured to implement unencoded differential communications. The encoder/decoder is communicatively coupled to the transceiver. The encoder/decoder is configured to implement communications to the transceiver using a subset of a code map of the encoded communications.