Rambus Inc.
Memory module with emulated memory device population

Last updated:

Abstract:

In a memory module having a plurality of discrete memory die packages, an N-bit data interface and a command/address buffer, a memory access command and chip-select input signals are received within the command/address buffer. In response to the chip-select input signals, the command/address buffer outputs chip-select output signals greater in quantity than the chip-select input signals to exclusively enable one of a plurality of groups of the discrete memory die packages to respond to the memory access command, each of the plurality of groups of the discrete memory die packages having a collective data interface width less than the N-bit data interface width.

Status:
Grant
Type:

Utility

Filling date:

10 Jul 2017

Issue date:

20 Jul 2021