Rambus Inc.
High capacity memory system using standard controller component
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Abstract:
The embodiments described herein describe technologies for using the memory modules in different modes of operation, such as in a standard multi-drop mode or as in a dynamic point-to-point (DPP) mode (also referred to herein as an enhanced mode). The memory modules can also be inserted in the sockets of the memory system in different configurations.
Status:
Grant
Type:
Utility
Filling date:
18 Oct 2019
Issue date:
1 Jun 2021