Rambus Inc.
Memory system design using buffer(s) on a mother board

Last updated:

Abstract:

A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.

Status:
Grant
Type:

Utility

Filling date:

1 Apr 2020

Issue date:

11 May 2021