Rambus Inc.
Semiconductor memory systems with on-die data buffering
Last updated:
Abstract:
A semiconductor memory system includes a first semiconductor memory die and a second semiconductor memory die. The first semiconductor memory die includes a primary data interface to receive an input data stream during write operations and to deserialize the input data stream into a first plurality of data streams, and also includes a secondary data interface, coupled to the primary data interface, to transmit the first plurality of data streams. The second semiconductor memory die includes a secondary data interface, coupled to the secondary data interface of the first semiconductor memory die, to receive the first plurality of data streams.
Status:
Grant
Type:
Utility
Filling date:
21 Aug 2019
Issue date:
10 Nov 2020