Rambus Inc.
Semiconductor memory systems with on-die data buffering

Last updated:

Abstract:

A semiconductor memory system includes a first semiconductor memory die and a second semiconductor memory die. The first semiconductor memory die includes a primary data interface to receive an input data stream during write operations and to deserialize the input data stream into a first plurality of data streams, and also includes a secondary data interface, coupled to the primary data interface, to transmit the first plurality of data streams. The second semiconductor memory die includes a secondary data interface, coupled to the secondary data interface of the first semiconductor memory die, to receive the first plurality of data streams.

Status:
Grant
Type:

Utility

Filling date:

24 Oct 2016

Issue date:

3 Sep 2019