SunPower Corporation
METHOD FOR RECYCLING SUB-MICRON SI-PARTICLES FROM A SI WAFER PRODUCTION PROCESS

Abstract:

A method is provided for recycling sub-micron Si-particles from a Si wafer production process resulting from a diamond fixed abrasive process including slicing and cutting, the method including the steps of: providing a paste of sub-micron Si-particles resulting from the diamond fixed abrasive process; drying and shaping the paste of sub-micron Si-particles into a layer; and applying a zone melting step to the dried and shaped layer of Si-particles on a substrate.