SunPower Corporation
Gripper for semiconductor devices

Abstract:

A wafer transfer system can include a wafer gripper for picking and placing semiconductor devices. In an embodiment, the wafer gripper can include a first portion, a second portion and a laminate between the first and second portion. In one embodiment, the first portion can comprise glass or tempered glass, where the first portion having at least one vacuum hole and is configured to receive the semiconductor device. In an embodiment, the second portion can include glass or tempered glass, the second portion having configured to use low air pressure from a closed vacuum to vacuum a wafer. In an embodiment, the laminate can bond the first portion to the second portion.