Texas Instruments Incorporated
Processing an optical device

Abstract:

A method for processing an integrated optical circuit chip includes securing a panel dam around a periphery of an array of integrated optical circuit chips that share a substrate. The method also includes filling an area circumscribed by the panel dam with an insulating polymer to a level below a top surface of the integrated optical circuit chips. The method further includes singulating a given integrated optical circuit chip in the array of integrated optical circuit chips.