Texas Instruments Incorporated
ENHANCED MOLD COMPOUND THERMAL CONDUCTIVITY

Abstract:

In examples, a semiconductor package comprises a semiconductor die having a first surface on which circuitry is formed and a second surface opposite the first surface. The semiconductor package includes a mold compound, the second surface facing the mold compound. The mold compound covers the semiconductor die; a set of conductive vias exposed to a top surface of the mold compound and coupled to a metal layer in the package; a set of first conductive members vertically aligned with the semiconductor die and exposed to the top surface of the mold compound; and a set of second conductive members coupling at least some of the set of conductive vias to at least some of the set of first conductive members. The set of second conductive members is exposed to the top surface of the mold compound.