Texas Instruments Incorporated
System and method of delivering slurry for chemical mechanical polishing

Abstract:

A chemical mechanical polishing (CMP) system that includes a platen, a conduit having a heating segment and a delivery outlet, and a heater coupled to the heating segment of the conduit. The delivery outlet is positioned adjacent to the platen, whereas the heating segment defines a dispensing distance with the delivery outlet. The dispensing distance is associated with a stability of a CMP slurry at an elevated temperature that is above an ambient temperature.