Texas Instruments Incorporated
INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTURING THE SAME

Abstract:

Integrated circuit packaging with cavities and methods of manufacturing the same are disclosed. An example apparatus includes a semiconductor die and a housing enclosing portions of the semiconductor die. The housing defines an opening that extends from a surface of the semiconductor die to an external environment, the housing formed of a first material. The example apparatus includes a second material disposed within the opening to block exposure of the semiconductor die to the external environment.