Texas Instruments Incorporated
SUSPENDED SEMICONDUCTOR DIES
Last updated:
Abstract:
In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.
Status:
Application
Type:
Utility
Filling date:
14 Dec 2020
Issue date:
16 Jun 2022