Texas Instruments Incorporated
SUSPENDED SEMICONDUCTOR DIES

Last updated:

Abstract:

In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.

Status:
Application
Type:

Utility

Filling date:

14 Dec 2020

Issue date:

16 Jun 2022