Texas Instruments Incorporated
QFN/QFP PACKAGE WITH INSULATED TOP-SIDE THERMAL PAD

Abstract:

A packaged electronic device comprises a die attach pad enclosed by a package structure, a semiconductor die mounted to a side of the die attach pad, a conductive plate and a polymer layer having a first side on a side of the conductive plate and a second side on the die attach pad. A method of manufacturing a packaged electronic device comprises attaching a first side of a polymer layer to a first side of a conductive plate, attaching a first side of a die attach pad to a second side of the polymer layer and attaching a first side of a semiconductor die to a second side of the die attach pad.