Texas Instruments Incorporated
LEAD FRAME ROLLING

Abstract:

A method includes rolling a roller with a protrusion across a lead frame to create an indent in a feature of the lead frame, attaching a die to a die attach pad of the lead frame, coupling the die with a lead, and enclosing portions of the die, the die attach pad, and portions of the lead frame feature with a molding compound. A system includes a roller with a cylindrical body and a protrusion, a chuck to engage a lead frame, and a controller to roll the roller across the lead frame to create an indent in a feature of the lead frame. An integrated circuit includes a package structure enclosing a first portion of a lead and a first portion of a die attach pad, and a rolled indent in the first portion of the lead or the die attach pad.