Texas Instruments Incorporated
ON-CHIP CURRENT SENSOR

Abstract:

A packaged electronic device has a die with a load circuit, a resistor and an analog to digital converter (ADC). The resistor is coupled between a supply node of the die and a power input of the load circuit. The ADC has a first input coupled to a first terminal of the resistor, and a second input coupled to a second terminal of the resistor to measure a voltage across the resistor while a supply voltage is applied to the supply node to determine a load current conducted by the load circuit. A method of manufacturing a packaged electronic device includes wafer processing to fabricate the load circuit, the resistor and the ADC on or in a die area of the wafer with the resistor coupled between the power input of the load circuit and the supply node of the die area.