Texas Instruments Incorporated
IMMERSION PLATING TREATMENTS FOR INDIUM PASSIVATION
Last updated:
Abstract:
A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.
Status:
Application
Type:
Utility
Filling date:
31 Dec 2019
Issue date:
1 Jul 2021