Texas Instruments Incorporated
THROUGH-GATE CO-IMPLANT SPECIES TO CONTROL DOPANT PROFILE IN TRANSISTORS

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Abstract:

In a described example, an integrated circuit (IC) includes a metal oxide semiconductor (MOS) transistor formed in a semiconductor substrate. The transistor includes a gate structure formed over a surface of the substrate and source and drain regions having a first conductivity type formed in the substrate on both sides of the gate structure. A well region having a second opposite conductivity type is between the source and drain regions under the gate structure. The well region includes a well dopant and a through-gate co-implant species. The well dopant and the co-implant species have a retrograde profile extending from the surface of the substrate into the well region.

Status:
Application
Type:

Utility

Filling date:

11 Dec 2020

Issue date:

24 Jun 2021