Texas Instruments Incorporated
Fail Density-Based Clustering for Yield Loss Detection
Last updated:
Abstract:
A method for failed die clustering is provided that includes extracting a data set of failed die on a wafer from a wafer map for the wafer, determining a density parameter for clustering the failed die, removing false failures from the data set of failed die to generate a reduced data set of failed die, locating clusters of failed die in the reduced data set by executing a density-based spatial clustering of applications with noise (DBSCAN) algorithm with the density parameter, and applying a guard band to each located cluster.
Status:
Application
Type:
Utility
Filling date:
12 Nov 2020
Issue date:
17 Jun 2021