Texas Instruments Incorporated
Integrated Circuit Package for Isolation Dies

Abstract:

In described examples of an isolation device, an isolation die that has a set of bond pads is mounted on a first lead frame that has a set of leads. A portion of the bond pads are coupled to respective leads. A first mold material encapsulates the isolation device and the first lead frame forming a first package. The first package is mounted on a second lead frame that has a set of leads. A portion of the first lead frame leads is coupled to respective ones of the second lead frame leads. A second mold material encapsulates the first package and the second lead frame.