Texas Instruments Incorporated
INTERPOSER BETWEEN MICROELECTRONIC PACKAGE SUBSTRATE AND DIELECTRIC WAVEGUIDE CONNECTOR FOR MM-WAVE APPLICATION
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Abstract:
An interposer acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect and establishes two well-defined reference planes that can be optimized independently. The interposer includes a block of material having: a first interface region to interface with an antenna coupled to an integrated circuit (IC); and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.
Status:
Application
Type:
Utility
Filling date:
4 Jan 2021
Issue date:
20 May 2021