Texas Instruments Incorporated
INTEGRATED CAPACITOR WITH SIDEWALL HAVING REDUCED ROUGHNESS
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Abstract:
An integrated capacitor on a semiconductor surface on a substrate includes a capacitor dielectric layer including at least one silicon compound material layer on a bottom plate. The capacitor dielectric layer includes a pitted sloped dielectric sidewall. Each of the pits is at least partially filled by one of a plurality of noncontiguous dielectric portions. A conformal dielectric layer may be formed over the noncontiguous dielectric portions. A top metal layer provides a top plate of the capacitor.
Status:
Application
Type:
Utility
Filling date:
25 Jan 2021
Issue date:
13 May 2021