Texas Instruments Incorporated
INTEGRATED CAPACITOR WITH SIDEWALL HAVING REDUCED ROUGHNESS

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Abstract:

An integrated capacitor on a semiconductor surface on a substrate includes a capacitor dielectric layer including at least one silicon compound material layer on a bottom plate. The capacitor dielectric layer includes a pitted sloped dielectric sidewall. Each of the pits is at least partially filled by one of a plurality of noncontiguous dielectric portions. A conformal dielectric layer may be formed over the noncontiguous dielectric portions. A top metal layer provides a top plate of the capacitor.

Status:
Application
Type:

Utility

Filling date:

25 Jan 2021

Issue date:

13 May 2021