Texas Instruments Incorporated
TESTING INTERPOSER METHOD AND APPARATUS

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Abstract:

The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

Status:
Application
Type:

Utility

Filling date:

13 Jan 2021

Issue date:

6 May 2021