Texas Instruments Incorporated
INTEGRATED CIRCUITS WITH CONDUCTIVE BUMPS HAVING A PROFILE WITH A WAVE PATTERN

Abstract:

An article of manufacture comprises: an integrated circuit having a contact; a conductive bump electrically coupled to the contact, the conductive bump having a profile with a wave pattern; a lead frame electrically coupled to the conductive bump; and an integrated circuit package mold, the integrated circuit package mold covering portions of the conductive bump and the lead frame.