Texas Instruments Incorporated
Flippable Leadframe for Packaged Electronic System Having Vertically Stacked Chip and Components

Abstract:

A leadframe for electronic systems comprising a first sub-leadframe connected by links to a second sub-leadframe, the first and second sub-leadframe connected by tiebars to a frame; and each link having a neck suitable for bending the link, the necks arrayed in a line operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.