Texas Instruments Incorporated
Semiconductor package with underfill between a sensor coil and a semiconductor die

Abstract:

A semiconductor package includes a leadframe including a sensor coil between sensor coil leads and further including a plurality of die leads physically and electrically separated from the sensor coil, and a semiconductor die over the leadframe with die contacts electrically connected to the die leads. The semiconductor die includes a sensor operable to detect magnetic fields created by electrical current through the sensor coil, the semiconductor die operable to output a signal representative of the detected magnetic fields via the die leads. The semiconductor package further includes a dielectric underfill filling a gap between the sensor coil and the semiconductor die, and a dielectric mold compound covering the sensor coil and the dielectric underfill and at least partially covering the semiconductor die and the die leads.