Texas Instruments Incorporated
Quad flat no-lead package with wettable flanges

Abstract:

A device and method for fabrication thereof is provided which results in corrosion resistance of metal flanges of a semiconductor package, such as a quad flat no-lead package (QFN). Using metal electroplating (such as electroplating of nickel (Ni) or nickel alloys on copper flanges of the QFN package), corrosion resistance for the flanges is provided using a process that allows an electric current to reach the entire backside of a substrate to permit electroplating. In addition, the method may be used to directly connect a semiconductor die to the metal substrate of the package.