Texas Instruments Incorporated
Multi-die module with contactless coupler and a coupling loss reduction structure

Last updated:

Abstract:

A multi-die module includes a first die with a first device and a second die with a second device. The multi-die module also includes a contactless coupler configured to convey signals between the first device and the second device. The multi-die module also includes a coupling loss reduction structure.

Status:
Grant
Type:

Utility

Filling date:

23 Dec 2018

Issue date:

16 Feb 2021