Texas Instruments Incorporated
Multi-die module with contactless coupler and a coupling loss reduction structure
Last updated:
Abstract:
A multi-die module includes a first die with a first device and a second die with a second device. The multi-die module also includes a contactless coupler configured to convey signals between the first device and the second device. The multi-die module also includes a coupling loss reduction structure.
Status:
Grant
Type:
Utility
Filling date:
23 Dec 2018
Issue date:
16 Feb 2021