Lockheed Martin Corporation
Interface assembly with a CTE matched constraint layer

Abstract:

An interface assembly includes a constraint layer formed from a material that provides a coefficient of thermal expansion match between first and second circuit board substrates. The constraint layer includes a waveguide cavity that extends between first and second opposing outer surface the constraint layer. The first and second circuit board substrates are respectively coupled to the first and second outer surfaces of the constraint layer via single ground connections. Portions of the first and second circuit board substrates are aligned with the waveguide cavity and positive connections are made between components of the first and second circuit boards through the waveguide cavity.